MICROCONTACT: PCBA OPTIMIZATION AND MINIATURIZATION WITH RIGID NEEDLE ADAPTER TECHNOLOGY

Program Description:

PCB designers strive to maximize test coverage by adding as many test points as possible on a substrate, which often clashes with test solutions that rely on conventional test probes. There is a refined solution: the rigid probe adapter. This high-precision technology supports ICT, FCT, and flashing with test points as small as 100µm in diameter, with pitches down to 250µm for PCBA, and even lower for chip, or flex. The benefit? Reducing test point pitch from 2mm to 400µm, for instance, increases gravimetric test-point density by about 25× on the same area enabling product miniaturization. Rigid probe adapters scale and adapt readily in size. For example 0.3mm test points across 400mm panels can be achieved. With certain systems, production can even adjust an adapter to each product batch within minutes, overcoming tolerance issues and ensuring rapid readiness for new lots. This is primarily for product designers. The benefit? Reducing test point pitch from 2mm to 400µm increases gravimetric test-point density by about 25× on the same area enabling product miniaturization.